Thermal Engineering Technical Leader

Job DescriptionJob DescriptionThermal Engineering Technical LeaderLocation: San Jose, CA (Hybrid – minimum 3 days onsite/week)Compensation: $168K – $241K base + bonus + potential RSUsEmployment Type: Full-time \u007C Direct HireIndustry: Hardware / Data Center / Networking SystemsClient: Confidential Global Technology Leader
OverviewA global hardware leader is seeking a Thermal Engineering Technical Leader to drive next- cooling solutions for high-performance compute and networking systems. This role requires deep experience with liquid and air cooling technologies, strong technical leadership, and the ability to work across engineering, operations, and supply chain teams.
You will lead the evaluation, design, validation, and qualification of thermal solutions at the product level, including cold plates, CDUs, heat sinks, vapor chambers, and interface materials. The ideal candidate will have experience in productizing thermal systems, not just lab validation or simulation.
ResponsibilitiesLead development and qualification of advanced thermal solutions for ASICs, optics, and power systemsOwn thermal system architecture: modeling, simulation, prototyping, and testingWork directly with suppliers and manufacturers on component integration, test plans, and performance validationDefine design parameters and correlate test results with simulations and modelsCollaborate with hardware design, mechanical, and reliability teams to ensure system-level thermal integrityContribute to long-term thermal roadmap for new platforms
Required QualificationsBachelor’s degree in Mechanical or Chemical Engineering (Master’s )8–15+ years of experience designing thermal solutions for electronic systemsStrong background in liquid cooling systems: cold plates, CDUs, manifolds, pumpsHands-on experience with system-level thermal validation and testingProficient in CFD tools, thermal simulation, and design-to-test correlationExperience with TIM materials, vapor chambers, and high-power air cooling technologies
AttributesExperience bringing liquid cooling products to market (not just concept or R&D)Knowledge of component packaging technologies: BGA, Flip-Chip, 2.5D/3DExperience with qualification methods, failure analysis, and system reliabilityEffective communicator with ability to present thermal findings to executive teamsCollaborative mindset; able to influence across cross-functional teams
Work EnvironmentOnsite Hybrid: Must be onsite in San Jose 3+ days per weekRelocation: Considered for exceptional candidatesHigh-visibility team with ownership of next-gen platform designStrategic alignment with AI and high-performance computing innovations

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