Thermal Field Application Engineer

Job DescriptionJob Description

Company Overview:

Established in Taiwan in 1974, Hon Hai Technology Group, commonly known as Foxconn, is the world’s largest electronics manufacturer and leading provider of technological solutions with a network of over 200 campuses across 24 countries. In the US, Foxconn employs 6,500 across 40 different sites with manufacturing operations in Virginia, Wisconsin, Ohio, Indiana, Texas and California. As of 2023, Foxconn ranks 32nd among the Fortune Global 500 and reported a revenue of approximately USD $213 billion in 2024.

The company’s diverse product offerings span four major segments: smart consumer electronics, cloud and networking solutions, computing and various other components. Foxconn makes 40% of the consumer electronics that we find in our everyday lives. In recent years, Hon Hai has adopted the 3+3 strategy, focusing on three emerging industries - electric vehicles, digital health solutions, and robotics - while leveraging three key technologies: next- communications, artificial intelligence (AI), and semiconductors. Together these initiatives position the company as a leader for innovation in the 21st century.

Hon Hai Technology Group is deeply committed to championing environmental sustainability within its manufacturing processes. By integrating sustainability into its operations framework, the company strives to serve as a best-practice model for global enterprises, enhancing corporate responsibility while meeting the growing demand for environmentally conscious productions methods.

Job Summary:

The primary function of the Thermal Field Application Engineer is to provide technical support for customer design and engineering teams, support integration and application of the company’s products in customer environments. This role acts as a bridge between R&D and client-facing functions to support successful product design, deployment, and ongoing performance.

Duties and Responsibilities:

• Provide technical support to customers on liquid-cooling modules, liquid cooling systems, cold plates, manifolds, and related components.
• Work closely with customers to understand system requirements and provide tailored technical proposals and product recommendations.
• Lead technical discussions, design reviews, and troubleshooting during product evaluation and deployment.
• Collaborate with internal R&D, manufacturing, and quality teams to ensure alignment on design specifications and validation plans.
• Support customer samples, testing coordination, and on-site issue resolution (including possible travel to customer facilities).
• Assist in preparing technical documents such as specifications, test reports, presentations, and failure analysis summaries.
• Collect customer feedback and market trends to provide input for future product development.
• Support business development teams with technical insights during customer engagement.

Education:

Bachelor’s degree or above in Mechanical Engineering, Thermal Engineering, Electrical Engineering, or related fields.

Experience:

• 3+ years of hands-on experience in liquid cooling, or thermal solution engineering, ideally in the data center, server, or semiconductor industry.
• Experience with thermal simulation tools or test instrumentation is a plus.
• Preferred experience working with hyperscale data centers, server OEM/ODM, or advanced cooling module suppliers.
• Preferred knowledge of large-scale thermal system integration and validation processes.
• Preferred familiarity with manufacturing processes related to cold plates, tubing, and liquid cooling modules.

Other Requirements:

• Solid understanding of heat transfer principles and liquid cooling system design.
• Strong problem-solving abilities with the capability to perform root cause analysis.
• Excellent communication skills and ability to work directly with customers.
• Willingness to travel domestically and internationally as needed.
• Fluent in English and Mandarin.

EEOC Statement

Foxconn is an equal opportunity employer that is committed to and inclusion in the workplace. Foxconn prohibits discrimination and harassment of any kind and provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to , , , , sex, , or , age, disability, marital status, genetics, , or any other protected characteristic as outlined by federal law. In addition to federal law requirements, Foxconn complies with applicable state and local laws governing nondiscrimination in employment in every location in which the company has facilities. This policy applies to all terms and conditions of employment, including recruiting, hiring, placement, promotion, termination, layoff, recall, and transfer, leaves of absence, compensation, and training.